According to the new report, the Snapdragon 8 Gen 1+ will bring a 10 percent boost in overall performance over the vanilla Snapdragon 8 Gen 1. The new chipset is also reportedly more stable with better thermal management and improved battery life. These results are based on test machines. But the real-world improvements should be in line with this. There have been reports recently that Qualcomm is planning to unveil the Snapdragon 8 Gen 1+ in May. But Yogesh now claims that the chipset will have a “commercial release” in June. This could either mean the processor will go official in May and the first batch of phones powered by it will arrive in the following month or the official announcement will not come until June. We should find that out in due course.
Qualcomm could finally have a Dimensity 9000 competitor in the Snapdragon 8 Gen 1+
If the Snapdragon 8 Gen 1+ arrives with all of these touted performance improvements then it could perform on par with MediaTek’s Dimensity 9000. The vanilla Snapdragon 8 Gen 1 should have been Qualcomm’s Dimensity 9000 competitor but not to be. It performed below expectations. Perhaps Samsung‘s chip fabrication tech is at fault here. The Korean giant has been having thermal and battery life issues with its chip technology for years and, unfortunately, Qualcomm was a victim of it. Due to component shortages, Qualcomm couldn’t have TSMC manufacture the Snapdragon 8 Gen 1 last year. The chipset was fabricated on Samsung’s 4nm process node, the same as the company’s in-house Exynos 2200 processor. Both chipsets came out with identical thermal, battery life, and stability issues. The Dimensity 9000, on the other hand, is based on TSMC’s 4nm fabrication process. The MediaTek processor defied expectations and performed exceptionally well. Qualcomm is now having the Taiwanese company manufacture the Snapdragon 8 Gen 1+ on the same process node. Early reports already suggest a notable improvement. This paints a pretty bleak picture for Samsung’s chip fabrication tech though. The Korean behemoth is expected to turn things around with its 3nm GAA (gate-all-around) architecture this year. It better does. TSMC will reportedly stick to the existing FinFET architecture for its 3nm chips, with GAA planned for 2nm chips in 2025.
